Semiconductor Packaging News
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain.
Semiconductor Packaging News Index
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. ...
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News
Three years on: Has India found its footing in the semiconductor industry? India launched an ambitious push into the global semiconductor industry on December 15, three years ago, aiming to break a seven-decade struggle.
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging …
Dec 24, 2024 · TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT providers, IDMs, and new players, traditional industry roles face significant disruption ...
Advanced Packaging: The Intensifying Strategic Game
The semiconductor industry is advancing with cutting-edge packaging technologies like 2.5D/3D, Chiplet, and FOWLP, delivering superior performance and integration. These innovations address AI, 5G, and HPC demands, reshaping competition and fueling rapid technological progress ...
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges ...
Semiconductor Packaging News
Qualcomm's interest in Intel cools Qualcomm has paused its interest in acquiring Intel due to financial, regulatory, and operational complexities, including Intel's $50 billion debt and unprofitable semiconductor unit.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech ...
Samsung automating semiconductor packaging, doubling efficiency
Samsung accelerates IC manufacturing with advanced packaging automation, aiming to enhance production efficiency. The tech giant has announced plans to implement cutting-edge automation technologies in its chip manufacturing process, streamlining operations and reducing human intervention. This move ...