Summary Canon's nanoimprint lithography (NIL) technology, launched in September, promises a cost-effective alternative to EUV lithography in advanced chipmaking. By stamping circuit patterns directly ...

Summary The U.S. launched a Section 301 investigation into China’s alleged dumping of mature-node chips, citing unfair trade practices. Analysts warn China's growing capacity could dominate global ...

China’s No 2 chip foundry Hua Hong names former Intel veteran as new president: Summary China’s Hua Hong Semiconductor has appointed ex-Intel executive Bai Peng, 62, as its ne ...

Hon Hai says it is partnering with Nvidia to develop humanoid robots: Summary Hon Hai Precision is teaming up with Nvidia to develop humanoid robots, integrating advanced AI hardw ...

Summary Canada's Critical Minerals Strategy 2024 emphasizes efforts to boost raw material production for semiconductors and EV batteries. Despite promising projects like Nechalacho and nickel ...

Foxconn beats estimates with record fourth-quarter revenue on AI demand: Summary Foxconn, the world's largest contract electronics maker, posted record fourth-quarter revenue of T ...

Summary Readers are captivated by advances in semiconductor tech, from millimeter-scale laser chips slicing steel to TSMC’s bold plan for GPUs with 1 trillion transistors. Highlighting 2023’s ...

Microsoft expects to spend $80 billion on AI-enabled data centers in fiscal 2025: Summary Microsoft plans to invest $80 billion in fiscal 2025 to expand AI-focused data centers, w ...

Summary Automotive leaders from AMD, Ansys, Cadence, Rambus, and Synopsys tackled the industry's transformation in a Semi ...

Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light on the evolving convergence between ASP and SMT.

Summary Qualcomm secured a legal victory against Arm Holdings, with jurors finding no breach of a chip technology license tied to Qualcomm's $1.4 billion Nuvia acquisition. However, Arm plans to seek ...

TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...