At APEC 2025, discussions spanned AI-driven data center power, the competition between GaN and SiC, and much more. At APEC 2025, discussions spanned AI-driven data center power, the competition ...

At APEC 2025 in Atlanta, Navitas CEO and Co-Founder Gene Sheridan discussed groundbreaking advancements in GaN and SiC technologies. He highlighted Navitas’ latest bi-directional GaN ICs, enabling ...

Future Electronics’ power system design laboratory, based in London, has implemented a SiC-MOSFET-based design for a 3-kW LLC power supply, which steps a nominal 390-VDC input down to a 49-VDC nominal ...

The global battery market is characterized by rapid expansion, driven mainly by the spread of sustainable mobility and the growing demand for energy storage solutions. In recent years, the battery ...

The use of an anti-parallel Schottky barrier diode (SBD) can improve the performance and reliability of silicon carbide MOSFETs in power conversion applications. In this article, we will showcase ...

At APEC 2025 (booth #1213), TI will showcase power solutions that help designers achieve higher power density and efficiency in demanding applications such as data centers. Now in its 40th year, the ...

TinySwitch-5 delivers up to 175 W output with 92% efficiency in a classic flyback architecture. Power Integrations has introduced the TinySwitch™-5 series, expanding the output power range of its ...

Battery makers must overhaul the basic chemistries to attain new levels of performance in energy density, safety, manufacturing scale, recycling, sustainable mining of materials, and cost. The average ...

The EliteSiC SPM 31 intelligent power modules (IPMs) increase efficiency and performance of inverter motor drives. onsemi has launched the first generation of its 1200V silicon carbide (SiC) metal ...

A special event held by Reuters on Dec. 9, 2024, discussed the potential outcomes of Trump’s election victory for the U.S. energy sector. The United States presidential election has been a recurrent ...

The FS1606 is the most compact 6A solution in the series, featuring full telemetry via an I²C interface within a 3.3 x 3.3 x 1.35 mm package. TDK Corporation has introduced the FS160* series of ...

The PMIC startup is redefining the future of AI server power technology by leveraging the advantages of third-generation semiconductor technology. As the backbone of computing infrastructure in the AI ...