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Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: A 16-element 140–160-GHz phased array transceiver is reported. The chipset is fabricated using STMicroelectronics’ 55-nm SiGe BiCMOS process. Five different chips are implemented: a ...
1. Is this request related to a challenge you're experiencing? Tell me about your story. Yes. I’m building a flow in Dify to classify documents using an LLM. Due to LLM context length limitations, I ...
new Claim( JwtClaimTypes.Address, $@"{{ 'street_address': '{Address1 ?? string.Empty}', 'locality': '{City ?? string.Empty}', 'region': '{State ?? string.Empty ...
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