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In the microelectronic packaging, the different function chips can be bonded with the silicon wafer by adhesive in chip-to-wafer (C2W) process, the area of the bonding zone may impact the warpage ...
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Aluminum-induced crystallization of hydrogenated amorphous silicon was used to fabricate epitaxial silicon films through solid phase epitaxy. Silicon wafers of (100) orientation were used as the ...
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