Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Harvard University designed a chip that can convert ...

A new technical paper titled “High-yield photolithography protocol to pattern metallic electrodes on 2D materials without ...

Layer Design of Vector-Symbolic Computing: Bridging Cognition and Brain-Inspired Hardware Acceleration” was published by ...

Unique designs and multi-die assemblies are forcing innovations at the leading edge of testing.

Water usage at scale requires sophisticated closed-loop systems, digital twins, and multiple filtration strategies, but can ...

Fig. 1: Modeling qubits in a realistic way involves large-scale atomistic models with possibly amorphous materials, disorder, ...

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but ...

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line ...