In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, ...

Abstract: In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly, ...

Abstract: In this paper, an integrated circuit (IC) solder joint inspection algorithm is proposed based on an adaptive-template method. To the best of our knowledge, it is the first time to utilize ...

Notifications You must be signed in to change notification settings Another iPhone to experiment on!!! I got this iPhone 7 after it was dropped and the screen completely shattered. This time I decided ...

Deniser is a drop-in replacement for the Amiga computer Denise chip. This repository contains board design files, FPGA logic source code and synthesis scripts. The idea is to make the material ...

In this informative video, learn how to make a USB soldering iron at home. Whether you're a DIY enthusiast or just looking to ...

ABC suspends Jimmy Kimmel's late-night show indefinitely over his remarks about Charlie Kirk’s death As US reliability ...

Want to learn 3D IC technology in one go? Here is all you need to know about this heterogeneous integration technique.

Here is how designers can break functional systems into sub-functional chiplets and use advanced packaging integration ...

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.