Researchers at Hugging Face created a benchmark measuring AI’s role in parasocial relationships, anthropomorphism, and ...

Lam Research's TEOS 3D system and SABRE 3D plating fuel $1B+ packaging revenues as AI drives chiplet adoption.

AI is now mission critical, powering airlines, hospitals, energy, manufacturing and disaster response to save lives and ...

Timing is increasingly dependent on vectors. Can static techniques continue to deliver the necessary results? Maybe.

A growing number of AI processors are being designed around specific workloads rather than standardized benchmarks, ...

Explore Autodesk's strategic AI advances, margin targets, and the future of design automation from their 2025 Goldman Sachs Technology Conference.

The arcade offers a perfect alternative to typical Southern California entertainment options. When you’ve exhausted the beaches, hiked all the trails, and can’t face the crowds at theme parks, Neon ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way ...

This article explores the science behind emerging 3D pregnancy scans and what the future holds for preventing pregnancy ...

TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence and high-performance computing applications.

The existing bottleneck in efficiently miniaturizing components for quantum computers could be eased with the help of 3D printing. Quantum computers tackle massive computational challenges by ...

Sometimes even Hollywood’s biggest stars need help with the most unglamorous problems. In an interview with NPR's Wild Card with Rachel Martin podcast, Harrison Ford, 83, revealed that when he needed ...