There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and HPC workloads better than we have been able to do thus far. But, as we were ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...

SK Hynix becomes the first company to finish developing HBM4 memory and announces plans for mass production ahead of Samsung ...

Kioxia Corporation today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) (1) enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the ...

ESC San Jose, Ca. – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), here unveiled a new development tool that helps developers avoid stack overflow ...

(MENAFN- GlobeNewsWire - Nasdaq) Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...