Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...

With its industry-standard tool for thermal and fluid analysis of space applications and satellites, C&R Technologies' thermal-centric modeling approach provides fast and effective system-level ...

V2.4 Sinda/G, advanced thermal-analysis software, is a network thermal analyzer that models systems by combining masses and linking them with conduction, convection, and radiation connections. It's ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

PITTSBURGH, USA: ANSYS has announced that its RedHawk and Totem products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET technology. TSMC has certified these ...

ANSYS has launched a new open neutral file format to help electronic component manufacturers and their customers to easily share design models between different thermal simulation toolsets. The open ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...

Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...