The thinness of silicon wafers is important because it reduces resistance and power loss. Current-gen wafers measure 40 to 60 ...

a fully automated grinding system that exposes through-Si via from the backside of silicon (Si) wafers was developed to ...

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry.

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 ...

It is prioritizing 12-inch silicon wafers while transitioning smaller-sized products to improve operational efficiency. Wafer ...

Infineon Technologies AG has progressed in its development of what it claims is the first 300 mm gallium nitride (GaN) power ...

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest ...

FormFactor’s extensive experience in silicon photonics, including wafer and die-level probing, allows us to support our customers at every stage—from initial development to full-scale production.” “As ...

Strong silicon wafer shipment growth is expected to continue through 2027 to meet increasing demand related to AI and ...

Infineon Technologies AG announced it has unveiled an advance in handling and processing "the thinnest silicon power wafers ever manufactured," with a thickness of 20 micrometers and a diameter of 300 ...

Q3 2024 Earnings Conference Call November 7, 2024 2:00 AM ETCompany ParticipantsKurt Levens - Chief Executive OfficerJack ...

This innovation will significantly help increase energy efficiency, power density and reliability in power conversion ...