Creating reusable and portable analog intellectual property (IP) is a key trend to watch in EDA for 2009 and beyond. Finding a way to develop reusable analog IP will allow designers to build ...
To overcome 45-nm process challenges, semiconductor intellectual property (IP) providers and foundries are collaborating to provide designers with a combination of design resources and manufacturing ...
As the first 64 Gbps UCIe™ IP subsystem implemented on TSMC's 3nm process, this achievement positions Alphawave Semi as a leader in UCIe die-to-die connectivity technology. With enhanced 64 Gbps UCIe ...
An underlying requirement for successful IP interchange between providers and integrators is a strong reliance on standards. Although the industry has achieved some success with a metric such as the ...
Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity ...
Deciding what to patent can be a confusing process but by creating a formal process it is something that every startup can manage. Intellectual property (IP) is one of the most valuable assets of a ...
ODVA has added process device profiles to the EtherNet/IP specification to provide a standard format for process variables and diagnostics and support Ethernet-APL. An example of EtherNet/IP CAT5e ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Cadence ® IP for GDDR6 is silicon proven on TSMC’s N6, immediately available on both N6 and N7 and ...
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