Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...
A new partnership between Virginia Tech and Fairfax County Public Schools brings hands-on tech and engineering lessons to the youngest students, and it’s lighting a fire in young minds. A second-grade ...
KALAMAZOO, Mich.—“Brilliance is in the basics.” It’s a quote aerospace engineering alumnus Adam Houtman uses to describe not only aircraft design but also something Western Michigan University's ...
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