As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean ...
Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...
An Nvidia (NVDA) partner in South Korea saw its shares surge Monday after it said the U.S.-based chipmaker wants chips faster ...
High-Bandwidth Memory 5 is intended to further increase the number of memory layers. This requires modern stacking technology ...
Nvidia CEO Jensen Huang has urged SK Hynix to accelerate the release of its high-bandwidth memory (HBM) chips, known as ...
Samsung declared progress in supplying AI memory chips to Nvidia Corp., seeking to reassure to investors who fear the company ...
ASM International (ASMIY) reported strong 3Q24 results, driven by robust demand for GAA and HBM technologies. Read why I ...
Samsung Electronics’ semiconductor chief, Jun Young-hyun, head of the Device Solutions (DS) division, recently launched a ...